All failures observed were wire breakage at the heel of the stich bond, in no case was lifting at the pad observed. ... I H Fig. 3b Thermosonic Gold to Permalloy Bonds.o Bond Pull as a Function of Ageing Time at 200 C. Assuming pan activation energy of 0.8eV for Au/A1Cu and ... Consequently no long term bonding reliability problem should exist. ... 3.2 Environmental Stress Tests Table 1 summarizes the results of the 7110 being subjected to standard semiconductor stress tests.
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