This book contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, U.K., 3-5 July, 2013). Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers state of art of tremendous advances in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science.Functionality of these products has also evolved at the same pace through packing in more and more features. ... Other important benefits of BGA include self-centering of solder balls during placement, higher ball pitch than the leaded flatanbsp;...
|Title||:||Transactions on Engineering Technologies|
|Author||:||Gi-Chul Yang, Sio-Iong Ao, Len Gelman|
|Publisher||:||Springer Science & Business - 2014-04-26|