System on Package

System on Package

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where a€œsystemsa€ used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.Family QFP BGA FC-BGA DCA 3D Packaging SOP Organic SOP Si SOP PoP SiP Package Si Eff. Wirebond Leadframe Wirebond Substrate Soler ball ... SOP. Substrate. with. Multilayer. Wiring. and. Thin-Film. Embedded. Components. 379.

Title:System on Package
Author:Rao Tummala
Publisher:McGraw Hill Professional - 2007-07-22


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