I 0 08 | 004 tr -FR-4B FR-4C Chart 4: Effect of Pad Diameter on Substrate on Equivalent Plastic Strains Conclusions and Suggestions for ... Future work at CASPaR research will focus on extending the solder model to three dimensions, obtaining more realistic ... The interconnect research at MaRC is funded by ATaamp;T, Ford Motor Company, MICOM, and Motorola. ... 12-19, 1993  Lau J., aquot; Thermomechanical Characterization of Flip Chip Solder Bumps for Multichip Module Applicationsaquot;, anbsp;...
|Title||:||Proceedings, 1996 International Conference on Multichip Modules|
|Author||:||International Society for Hybrid Microelectronics, Semiconductor Equipment and Materials International|