ISTFA 2013

ISTFA 2013

4.11 - 1251 ratings - Source

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.In reality, it represents just one of the tools in the Chip Edit tool box. ... The challenge is to accomplish this over a chip-level wide area, transferring it from a FIB chemical process to one of mechanical milling. ... We typically open up only as much buried oxide floor as needed to execute the repair, as shown in Figure 11.

Title:ISTFA 2013
Publisher:ASM International - 2013


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