The hardness of pure Au films was found to be approximately 1.2 GPa and increased by about 40--80% (1.64 GPa--2.13 GPa) by the addition of 2.5 and 6 at. % Si, respectively and approximately 102% to 2.41 GPa by the addition of 21 at. % Si. The film resistivity increased nearly linearly from 5.58--38.15 microO-cm as the Si content increased from 2.5--21 at. %, respectively. K. Seshan, editor. Handbook of Thin-Film Deposition Process and Techniques - Principles, Methods, Equipment and Applications. William ... Plenum Press, New York, 1998.  Bruker AXS Inc. Diffraction Solutions - D8 Advance, 2008.
|Title||:||Investigation of the Near Surface Mechanical Properties of Gold-silicon Thin Films|
|Author||:||Benjamin Michael Dvorak|
|Publisher||:||ProQuest - 2008|