phase diagram, which is a pan of the ternary Au-Sn-Pb system 1221. only Au and Sn form intermetallic compounds. No Au ... tapes with different gold metallizations were bonded to printed wiring boards with a different thickness of the eutectic Sn/ Pb solder layer. ... was performed with both WDS and EDS analysis using a microprobe from CAMECA respectively a SEM with the exL 10 system from LINK.
|Title||:||IEEE/CHMT International Electronic Manufacturing Technology Symposium|
|Author||:||Institute of Electrical and Electronics Engineers|