The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.CIS see CMOS image sensor clamping force 368, 371 CMOS a compatibility to bonding methods 204, 262 a low-k three ... phase diagram 187 copper/tin SLID process 184 f, 346 a application of 201 ff a bond formation 189, 191 f a bondinganbsp;...
|Title||:||Handbook of Wafer Bonding|
|Author||:||Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo|
|Publisher||:||John Wiley & Sons - 2012-02-13|