The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.34.3.2 Wafer Stacking Using Copper Bonding 22.214.171.124 Copper Bonding Process For the microprocessor logic splitting ... The basic process flow for making a two- layer structure with wafer level copper bonding is shown in Figure 34.8. As this is anbsp;...
|Title||:||Handbook of 3D Integration|
|Author||:||Philip Garrou, Christopher Bower, Peter Ramm|
|Publisher||:||John Wiley & Sons - 2011-09-22|