This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro a Nanosystems'. A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon processing. An insider's view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro- and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass data storage and electrochemical imaging by means of scanning micro- and nanoprobes. The second section on nanodevices first tackles the emerging topic of nanofluidics with a contribution each on simulation tools and on devices and uses, followed by another two on nanosensors featuring CNT sensors and CMOS-based DNA sensor arrays, respectively.4.3 Case Studies a Packaging of Physical Sensors 4.3.1 Case Study 1: Tire Pressure Sensor Packaging Commercial package development for MEMS pressure sensor devices is intimately linked to silicon development for (at least) threeanbsp;...
|Title||:||Enabling Technologies for MEMS and Nanodevices|
|Author||:||Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata|
|Publisher||:||John Wiley & Sons - 2013-03-27|