The feasibility of a new 3D integration technology platform has been demonstrated with critical unit processes characterized. Key results include the demonstration of inter-wafer via-chains, material characterization for partially cured BCB for this new bonding application, and quantification of topography accommodation.By using damascene patterned copper/BCB as a bonding surface, inter-wafer interconnection and mechanically robust wafer bonding can be achieved in a single unit process step. Figure 3.1 shows a schematic diagram of the metal/ adhesiveanbsp;...
|Title||:||Damascene Patterned Metal/adhesive Wafer Bonding for Three-dimensional Integration|
|Author||:||J. Jay McMahon|
|Publisher||:||ProQuest - 2008|