Advanced Packaging

Advanced Packaging

4.11 - 1251 ratings - Source

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.The IBIS products now cover production-scale solder bump inspection for IC substrates and a laboratory-scale version of the same equipment with in-depth analysis tools for solder ... These products will have field use in early 2007 and will be finely tuned tools by mid-year. ... Investment in new technology continues at a brisk pace, driving the need for innovative package design and prototyping services.

Title:Advanced Packaging
Publisher: - 2007-01


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