Two kinds of interconnection methods were initially considered for the middle lead bonding. ... Die Bonding, Wire-bonding, and Coating The integrated circuit chips were bonded to the flexible circuit tape through non-conductive die adhesiveanbsp;...
|Title||:||1995 IEEE/CPMT 17th International Electronics Manufacturing Technology Symposium|
|Publisher||:||Institute of Electrical & Electronics Engineers(IEEE) - 1995-01-01|